TL;DR: SK hynix CEO Kwak Noh-Jung unveiled the "Full Stack AI Memory Creator" vision at the SK AI Summit 2025, emphasizing collaboration to overcome AI memory challenges. SK hynix aims to lead AI ...

High Bandwidth Memory (HBM) is the commonly used type of DRAM for data center GPUs like NVIDIA's H200 and AMD's MI325X. High Bandwidth Flash (HBF) is a stack of flash chips with an HBM interface. What ...

Forward-looking: Major chipmaking companies have been trying to stack different kinds of silicon components onto each other for quite some time. Now, Samsung is apparently ready to debut a significant ...

Jamie has been abusing computers since he was a little lad. What began as a curiosity quickly turned into an obsession. As senior editor for Techgage, Jamie handles content publishing, web development ...

At the SK AI Summit 2025 in Seoul on November 3, 2025, SK Hynix CEO Kwak Noh-jung announced a major strategic overhaul, revealing plans to transform the South Korean memory maker from a traditional ...

SAN JOSE, Calif.--(BUSINESS WIRE)--KIOXIA America, Inc. today announced that its KIOXIA LC9 Series 245.76 terabyte (TB) 1 enterprise SSD, utilizing a 32-die stack KIOXIA BiCS FLASH™ generation 8 QLC ...

Lam Research Corporation is a $17 billion wafer-fabrication equipment maker. They are simulating and designing next generation computer memory. Its products are used primarily in front-end wafer ...