Computer-on-Modules for an efficient entry into rugged embedded edge AI applications

COM Express Compact module based on the latest AMD Ryzen™ AI Embedded P100 processor series. SAN DIEGO, CA, UNITED STATES, January 20, 2026 /EINPresswire.com/ ...
Electronic Design

11 Myths About the COM-HPC Computer-On-Module Standard

Addressing applications that require high performance and scalability, PICMG’s COM-HPC is often found in industrial automation, telecommunications, medical devices, embedded systems, edge computing, ...
The Indianapolis Star

congatec expands its Computer-on-Module portfolio with 18 new product families

Integration of JUMPtec modules creates the world’s most comprehensive portfolio of application-ready COM platforms SAN DIEGO, CA, UNITED STATES, January 9, 2026 ...