Today’s 3D integrated circuit (3D-IC) technology is the culmination of 40 years of research in universities and laboratories scattered across the globe. Beginning with dynamic random-access memory ...

Sophisticated numerics integrate multiphysics solvers to advance electronic innovations – from 3D integrated circuits (3D-IC) to electric vehicles The Ansys Discovery simulation-driven design tool ...

Innovation in semiconductor design today is energized primarily by AI/ML, data centers, autonomous and electric vehicles, 5G/6G, and IoT. Recently developed 2.5 and 3D-IC silicon-based packaging ...

Consumer electronics – tablets, smartphones and e-readers – is now leading the industry in growth. For system manufacturers and integrated circuit (IC) suppliers, the challenge involves keeping pace ...

Ansys expands long-term collaboration with Microsoft to increase availability of Ansys' simulation solutions and tools on the Microsoft Azure cloud-computing platform, providing customers with browser ...

Ansys released a report presenting a new methodology for using simulation to measure and assess the sustainability impact of decisions made during early design stages and throughout the product life ...