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3D X-DRAM aims for 10x capacity of today's memory — NEO Semiconductor's memory has up to 512 Gb per module
NEO Semiconductor is once again announcing a new technology that hopes to revolutionize the state of DRAM memory. Today, the company unveiled two new 3D X-DRAM cell designs, 1T1C and 3T0C. The ...
The takeaway at today's Intel press event? All signs point to the RealSense product line -- a number of hardware and software products that "make interaction with technology simple, more natural and ...
Raspberry Pi’s new Compute Module 3 has serious competition coming its way from the maker of the Pine64 board computer. The new SOPINE A64 64-bit computing module is a smaller version of the popular ...
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